Windows 10 surface pro 4 surface me drivers

... Intel Management Engine Interface - System devices - Surface - Firmware - 15.0.2473.3: Surface ME - Firmware - Surface - Firmware - 25.100.143.0: Surface UEFI - Firmware - MBIHV - Firmware - ... MBIHV Mobile Broadband Firmware Device - Firmware - Surface - Firmware - 2.23.139.0: Surface Pen Cfu Over Ble LC Connection - Firmware ...

... System - 2334.5.1.0: Intel Management Engine Interface - Surface - Firmware - 25.100.143.0: Surface UEFI - Firmware - Surface - Firmware - 15.0.2473.3: Surface ME - Firmware Driver Versions:- dax3_swc_aposvc: 3.30508.581.0 - SurfaceAPOSwcInstaller: 1.169.137.3 - SurfaceBattery: 2.80.139.0 - WbfUsbDriver: 4.15.12412.20015 - ibtusb: 22.230.0.2 - ... 31.0.101.3889 - ov13858_extension: 60.22000.5.12796 - ov5693_extension: 60.22000.5.12796 - SurfaceAPOExtension: 1.169.137.0 - SurfaceCoverClick: 2.27.139.0 - SurfaceDock2FwUpdate: 6.13.137.0 - ...

... VRM heatsink: Metal fin array connected to large surface area via a heatpipe tames X299 thermals to enable unthrottled performance. - Next-gen transfer speeds: Up to 32Gbps dual M.2 and U.2, plus up to 10Gbps USB 3.1 Type-A and Type-C connections. This package contains the files needed for installing ...

... VRM heatsink: Metal fin array connected to large surface area via a heatpipe tames X299 thermals to enable unthrottled performance. - Next-gen transfer speeds: Up to 32Gbps dual M.2 and U.2, plus up to 10Gbps USB 3.1 Type-A and Type-C connections. This package contains the files needed for installing ...

... VRM heatsink: Metal fin array connected to large surface area via a heatpipe tames X299 thermals to enable unthrottled performance. - Next-gen transfer speeds: Up to 32Gbps dual M.2 and U.2, plus up to 10Gbps USB 3.1 Type-A and Type-C connections. This package contains the files needed for installing ...

... VRM heatsink: Metal fin array connected to large surface area via a heatpipe tames X299 thermals to enable unthrottled performance. - Next-gen transfer speeds: Up to 32Gbps dual M.2 and U.2, plus up to 10Gbps USB 3.1 Type-A and Type-C connections. This package contains the files needed for installing ...

... VRM heatsink: Metal fin array connected to large surface area via a heatpipe tames X299 thermals to enable unthrottled performance. - Next-gen transfer speeds: Up to 32Gbps dual M.2 and U.2, plus up to 10Gbps USB 3.1 Type-A and Type-C connections. This package contains the files needed for installing ...

... VRM heatsink: Metal fin array connected to large surface area via a heatpipe tames X299 thermals to enable unthrottled performance. - Next-gen transfer speeds: Up to 32Gbps dual M.2 and U.2, plus up to 10Gbps USB 3.1 Type-A and Type-C connections. This package contains the files needed for installing ...

... - Enlarged VRM Heatsink with Multi-Cut to increased surface contact - Dual Ultra-Fast NVMe PCIe 4.0/3.0 x4 ... Supports Intel Iris graphics, Intel Iris Pro graphics and Intel HD graphics on: - Apollo Lake - 6th Gen Intel Core processor family (Codename Skylake) ...

... Enlarged VRM Heatsink with Air-Flow Grooving to Increased Surface Contact - Fast 2.5GbE LAN with Bandwidth Management ... Supports Intel Iris graphics, Intel Iris Pro graphics and Intel HD graphics on: - Apollo Lake - 6th Gen Intel Core processor family (Codename Skylake) ...